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Metallic nanowire interconnections for integrated circuit fabrication
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 2007 |
| Description | A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs. |
| File Size | 1389255 |
| Page Count | 10 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20070023682 |
| Archival Resource Key | ark:/13960/t74v1kf4r |
| Language | English |
| Publisher Date | 2007-05-15 |
| Access Restriction | Open |
| Subject Keyword | Electronics And Electrical Engineering Integrated Circuits Patents Insulation Nanofabrication Catalysts Metals Vapors Nanowires Nanostructures Devices Nanotechnology Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |
