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Development of low cost contacts to silicon solar cells (Document No: 19790023586)
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Tanner, D. P. Iles, P. A. |
| Copyright Year | 1979 |
| Description | Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation. |
| File Size | 12187452 |
| Page Count | 75 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19790023586 |
| Archival Resource Key | ark:/13960/t7zm05231 |
| Language | English |
| Publisher Date | 1979-05-31 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Solar Cells Electric Conductors Heat Treatment Electric Contacts Metallizing Palladium Silicon Junctions Electroplating Electrical Resistivity Semiconductors Materials Temperature Effects Chromium Silicon Copper Electric Current Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
