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Thermal and bias cycling stabilizes planar silicon devices
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1967 |
| Description | Terminal burn-in or baking step time in the processing of planar silicon devices is extended to reduce their inversion tendencies. The collector-base junction of the device is also cyclically biased during the burn-in. |
| File Size | 219302 |
| Page Count | 2 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19670000176 |
| Archival Resource Key | ark:/13960/t49p7sm0t |
| Language | English |
| Publisher Date | 1967-06-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |