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The effects of electromigration to the solder joint formation: a comparison between 99.3sn-0.7cu and 96.5sn-3.0ag-0.5cu lead free solder.
| Content Provider | CiteSeerX |
|---|---|
| Author | Lee C., S. Ahmad, Khairel Rafezi Somidin, Flora Suhada, A. R. Nik Nurhidayatul Mohd Salleh M. A., A. Hussin, Kamarudin |
| Abstract | Abstract. Electromigration effects on the solder joint formation of 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu lead-free solder with Cu electroplated Ni layer wire were investigated. The electromigration effects on the solder joints were studied after current density stressing at 1 x 10 3 |
| File Format | |
| Access Restriction | Open |
| Content Type | Text |