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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Kuduva-Raman Byung, H. Kim Yao, Donggang |
| Copyright Year | 2013 |
| Abstract | A new variant of the hot embossing process has been conducted with amorphous PEEK films as a model material. Constant Temperature Embossing (CTE) utilizes the crystallizing nature of amorphous polymers such as poly (ether ether ketone) (PEEK), poly (ethylene terephthalate) (PET) and poly (ethylene naphthalate) (PEN) when heated above their glass transition temperature to eliminate the thermal cycling. The key process parameters such as embossing temperature and embossing time depend on the thermal behavior of the amorphous PEEK film. Embossing studies were conducted using silicon tools with microchannel arrays of different aspect ratios, and the films were characterized using scanning electron microscopy and optical profilometry. The process enables a simple isothermal embossing process for polymers that have a glass transition temperature well above the room temperature and also with a wide temperature gap between the glass transition temperature and melting point. |
| Sponsorship | Manufacturing Engineering Division |
| File Format | |
| ISBN | 9780791855454 |
| DOI | 10.1115/MSEC2013-1175 |
| Volume Number | Volume 1: Processing |
| Conference Proceedings | ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference |
| Language | English |
| Publisher Date | 2013-06-10 |
| Publisher Place | Madison, Wisconsin, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Glass transition Scanning electron microscopy Temperature Embossing Ethers (class of compounds) Silicon Polymers Melting point Microchannels |
| Content Type | Text |
| Resource Type | Article |
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