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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Keith, A. Bourne Shiv, G. Kapoor |
| Copyright Year | 2012 |
| Abstract | Careful monitoring of conditions during micro-drilling is important for insuring production of consistent high-quality holes. In this study, acoustic emission, ultrasonic sound, and electric spindle load were used to monitor micro-drilling performed using a micro-scale machine tool (mMT). Experiments were conducted where 0.508 mm diameter holes were drilled in polyetheretherketone (PEEK) polymer and 316 stainless steel. It was found that spindle load significantly increased when tool gumming occurred during drilling of PEEK. Increased spindle load when cutting 316 stainless steel was found to correspond to increased incidences of tool breakage, and a large reduction in spindle load was present during additional drilling operations following a breakage event. It was found that elevated acoustic emission levels were always present during drilling and that a lack of sufficient acoustic emission generation during retraction of a tool indicated tool breakage. The ultrasonic sound spectra were found to change in a manner that is a function of depth of cut and hence a function of depth of cut dependent tool dynamics. |
| Sponsorship | Manufacturing Engineering Division |
| Starting Page | 781 |
| Ending Page | 790 |
| Page Count | 10 |
| File Format | |
| ISBN | 9780791854990 |
| DOI | 10.1115/MSEC2012-7341 |
| Volume Number | ASME 2012 International Manufacturing Science and Engineering Conference |
| Conference Proceedings | ASME 2012 International Manufacturing Science and Engineering Conference collocated with the 40th North American Manufacturing Research Conference and in participation with the International Conference on Tribology Materials and Processing |
| Language | English |
| Publisher Date | 2012-06-04 |
| Publisher Place | Notre Dame, Indiana, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Drilling Process monitoring Cutting Spectra (spectroscopy) Dynamics (mechanics) Microscale devices Stainless steel Sensors Machine tools Polymers Stress Acoustic emissions |
| Content Type | Text |
| Resource Type | Article |
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