NDLI: Thermal Management of a Notebook Computer

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chiang, S. B. Chien, K. H. Yang, K. S. Wu, S. K. Wang, C. C.
Copyright Year	2005
Abstract	In this study, simulations are made to resolve a 100 W heat dissipating capacity of a portable PC in (with a CPU IHS size of 31 mm × 31 mm). The problem is investigated via a commercially available software (Icepak version 4.1). The present design incorporates heat pipe to convey heat from the hot spot towards the heat sinks. The heat sinks are optimized subject to heat loads and their locations. The calculated results of a double heat sinks design show a 30 °C less temperature when compared to a single heat sink module. This is because double heat sinks design provides much more uniform temperature and eliminates the edge effect. Moreover, the effect of fin pitches is also examined in this study. It is found that the best performance is at a fin thickness of 0.2 mm and at a fin pitch of 2.4 mm. Depending on the optimal parameters of the thermal module, the chip temperature can be reduced to approximately 75 °C.
Sponsorship	Heat Transfer Division
Starting Page	831
Ending Page	835
Page Count	5
File Format	PDF
ISBN	0791842215
DOI	10.1115/IMECE2005-82670
e-ISBN	0791837696
Volume Number	Heat Transfer, Part A
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Design Heat Temperature Laptop computers Simulation Computer software Heat pipes Thermal management Engineering simulation Heat sinks Stress
Content Type	Text
Resource Type	Article

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