NDLI: Optimized Thermal Design for USB-WLAN Module

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chen, Eason Lai, Jeng Yuan Wang, Ming Zong Wang, Yu-Po Hsiao, C. S.
Copyright Year	2005
Abstract	With the increasing demands of wireless network, WLAN modules are developed with various kinds of product patterns; USB type among all is popular for portability. In the market, most USB-WLAN products are made in small form factors that advantage to carry and use as daily portable electronic products. However, the compact size of USB-WLAN elevates the junction temperatures of every package in the module that potentially downgrade the reliability of product. This is a severe challenge for package and module designers that drive a necessity to characterize the thermal behavior from package level to module level to ensure the success of product development. A thermal study was therefore considered for an USB-WLAN module having Baseband, RF and PA packages mounted on a PCB. The characterizations for a commercial USB-WLAN module were conducted with a computational fluid dynamics (CFD) tool to cover the following factors: package design of Base-band and PA, power input level, PCB size and PCB design. The selections of Base-band and PA packages with better Theta_JB performance resulted in better thermal dissipation into PCB. Several power density levels were performed to observe the heat transfer interactions among packages. Different designs of PCB Cu layer, thermal via number and distribution were then investigated in module level simulations for package thermal enhancement. Finally a sample of USB-WLAN module was also built to examine the accuracy of modeling with good agreement.
Sponsorship	Heat Transfer Division
Starting Page	775
Ending Page	779
Page Count	5
File Format	PDF
ISBN	0791842215
DOI	10.1115/IMECE2005-82247
e-ISBN	0791837696
Volume Number	Heat Transfer, Part A
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Thermal optimization Cfd Measurement Simulation Usb-wlan Design Wireless lan Computational fluid dynamics
Content Type	Text
Resource Type	Article

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