NDLI: Effect of Drop Impact on the Leakage of an Insulin Pump

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Liu, Sheng Ma, Bin Zhang, Honghai Gan, Zhiyin Zhou, Mingcai Wang, Xiaojun
Copyright Year	2004
Abstract	Drop impact to portable medical electronics devices products may cause significant functional and physical damage. It is well known that insulin pumps are susceptible to drop impact which can cause various damage modes such as blending air in insulin liquid, interface breakage, battery separation, possible debonding between syringe and pipe, cracking on the LCD. This paper for the first time examines the insulin pump drop impact orientation and drop heights. A method by actual drop test using a sample pump as an example is proposed. Of interest is the measurement of the level of shock and the impact orientation experienced by the electronic components in the insulin pump during impact. The drop impact responses examined are the impact force and the strains and level of shock induced at the pump’s interfaces. A better understanding of the shock induced at the electronic components and packages in the products can assist manufacturers not only in designing better components and electronic package but also products which are more robust and reliable to handle shock and impact loading. Permanent deformation, stress, strain on the critical parts are examined and the effect on the possible leakage are examined.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	445
Ending Page	450
Page Count	6
File Format	PDF
ISBN	0791847071
DOI	10.1115/IMECE2004-62505
Volume Number	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Conference Proceedings	ASME 2004 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2004-11-13
Publisher Place	Anaheim, California, USA
Access Restriction	Subscribed
Subject Keyword	Leakage Cracking (materials) Deformation Electronic components Electronics Batteries Electronic packages Separation (technology) Stress Design Fracture (process) Biomedicine Pumps Shock (mechanics) Damage Pipes
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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