NDLI: The Influence of Underfill Properties on the Fatigue Life of Ball Grid Array Packages

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Verges, Melody Arthur Chilakamarthi, Geetha
Copyright Year	2004
Abstract	The influence of underfill material properties on the fatigue life of a Ball Grid Array (BGA) package in the presence of thermal cycling is investigated in this study. The underfill material properties that are varied include Young’s modulus, Poisson’s ratio, and the coefficient of thermal expansion. The range in values are in accordance with typical underfills used in packages today. A finite element model is created using general purpose Ansys code by assuming that there exists an infinite array of solder interconnects, cylindrical in shape, surrounded by underfill material. The finite element geometry generated consists of a unit cell of concentric cylinders, with the inner being solder material and the outer being underfill material. The interconnect material is modeled as eutectic solder that behaves elastically-perfectly plastic. The Mode I cyclic stresses in the solder are determined as a temperature loading is applied. These stresses are then compared to the residual compressive stresses that are induced as a result of underfill shrinkage upon curing. Results suggest that Mode I stresses induced in the interconnects upon thermal cycling are not negligible in comparison to the beneficial compression that they provide upon curing. Even in the presence of this residual compression, for several material combinations a substantial amount of tension is induced in the connections while being cycled.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	175
Ending Page	179
Page Count	5
File Format	PDF
ISBN	0791847071
DOI	10.1115/IMECE2004-59970
Volume Number	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Conference Proceedings	ASME 2004 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2004-11-13
Publisher Place	Anaheim, California, USA
Access Restriction	Subscribed
Subject Keyword	Fatigue life Solders Compression Temperature Shrinkage (materials) Stress Geometry Thermal expansion Young's modulus Compressive stress Finite element model Ball-grid-array packages Ball-grid-array packaging Poisson ratio Materials properties Tension Finite element analysis Shapes Hardening (curing) Cylinders
Content Type	Text
Resource Type	Article

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