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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Shen, Y. -L Abell, K. C. R. Garrett, S. E. |
| Copyright Year | 2002 |
| Abstract | Experiments on the eutectic tin-lead alloy were conducted to study the effects of grain boundary sliding on the deformation and damage processes at the microscopic level. The primary objective is to gain mechanistic understandings of solder joint reliability in microelectronic packaging. Bulk specimens were subject to relatively fast deformations of tension, compression and bending, for the purposes of examining the pure mechanical effect without the influence of diffusion related phenomena. Grain realignment and phase redistribution were characterized by microscopy and microhardness indentation. A micromechanical model is proposed to elucidate the observed microstructural changes and progressive damage. This study illustrates the significance of damage in the form of microscopic heterogeneity caused by grain boundary sliding. It also illustrates the possibility of mechanically induced phase coarsening in actual solder joints. High-frequency cyclic shear tests on tin-lead solder joints showed damage along the coarsened band after only a short time, in accord with the proposed effects. Boundary sliding without the influence of atomic diffusion plays an essential role in fatigue damage in solder. |
| Sponsorship | Applied Mechanics Division |
| Starting Page | 71 |
| Ending Page | 78 |
| Page Count | 8 |
| File Format | |
| ISBN | 0791836274 |
| DOI | 10.1115/IMECE2002-32885 |
| Volume Number | Applied Mechanics and Biomedical Technology |
| Conference Proceedings | ASME 2002 International Mechanical Engineering Congress and Exposition |
| Language | English |
| Publisher Date | 2002-11-17 |
| Publisher Place | New Orleans, Louisiana, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Grain boundaries Solder joints Compression Solders Deformation Alloys Mechanical properties Diffusion (physics) Microhardness Microscopy Tension Damage Reliability Shear (mechanics) Fatigue damage Microelectronic packaging |
| Content Type | Text |
| Resource Type | Article |
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