NDLI: Microstructural Damage and Evolution of a PbSn Solder Alloy Under Isothermal Cyclic Loading

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Lim, T. Jesse Lu, Wei-Yang
Copyright Year	2002
Abstract	In our recent experiments, torsional specimens of PbSn Solder Alloy were cyclically loaded under different loading levels at both room temperature and high temperature (1008C). In these experiments, the Pb-rich phase size and micro-crack damage were also observed using scanning electron microscopy in-between loading cycles. At the moderate strain rate (10−4), the growth of Pb-rich phase does not differ much for both temperatures. At room temperature, the damage in the form of micro-cracks along the Pb- and Sn-rich phases are formed during early cycling, and the damage accumulates as the cycling proceeds. At high temperature, the damage does not accumulates as fast as for the similar strain level in room temperature, due to the lowering of stress level in high temperature and dynamic restructuring of Pb-rich phase.
Sponsorship	Applied Mechanics Division
Starting Page	55
Ending Page	60
Page Count	6
File Format	PDF
ISBN	0791836274
DOI	10.1115/IMECE2002-32867
Volume Number	Applied Mechanics and Biomedical Technology
Conference Proceedings	ASME 2002 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2002-11-17
Publisher Place	New Orleans, Louisiana, USA
Access Restriction	Subscribed
Subject Keyword	Microcracks Cycles Scanning electron microscopy Solders Temperature Alloys Tin High temperature Damage Stress
Content Type	Text
Resource Type	Article

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