NDLI: Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Eblen, Mark
Copyright Year	2010
Abstract	Thermal management of flip chip style integrated circuits often relies on thermal conduction through the ceramic package and high lead solder grid array leads into the printed wiring board as the primary path for heat removal. Thermal analysis of this package configuration requires accurate characterization of the sometimes geometrically complex package-to-board interface. Given the unique structure of the Six Sigma column grid array (CGA) interconnect, a detailed finite element submodel was used to numerically derive the effective thermal conductivity with comparisons to a conventional CGA interconnect. Once an effective thermal conductivity value is obtained, the entire interconnect layer can be represented as a fictitious cuboid layer for inclusion in a more traditional “closed-form” thermal resistance calculation. This method allows the package designer a quick and robust method to evaluate initial thermal design study tradeoffs.
Sponsorship	Heat Transfer Division
Starting Page	603
Ending Page	610
Page Count	8
File Format	PDF
ISBN	9780791849385
DOI	10.1115/IHTC14-22891
e-ISBN	9780791838792
Volume Number	2010 14th International Heat Transfer Conference, Volume 3
Conference Proceedings	2010 14th International Heat Transfer Conference
Language	English
Publisher Date	2010-08-08
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Solders Flip-chip Ceramics Design Heat conduction Integrated circuits Heat Printed circuit boards Thermal resistance Tradeoffs Thermal conductivity Thermal management Finite element analysis Thermal analysis Copper Flip-chip devices
Content Type	Text
Resource Type	Article

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