NDLI: Closing the smoothness and uniformity gap in area fill synthesis

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Closing the smoothness and uniformity gap in area fill synthesis

Content Provider	ACM Digital Library
Author	Zelikovsky, Alexander Kahng, Andrew B. Chen, Yu Robins, Gabriel
Abstract	Control of variability in the back end of the line, and hence in interconnect performance as well, has become extremely difficult with the introduction of new materials such as copper and low-k dielectrics. Uniformity of chemical-mechanical planarization (CMP) requires the addition of area fill geometries into the layout, in order to smoothen the variation of feature densities across the die. Our work addresses the following smoothness gap in the recent literature on area fill synthesis. (1)The very first paper on the filling problem (Kahng et al., ISPD98 [7]) noted that there is potentially a large difference between the optimum window densities in fixed dissections vs. when all possible windows in the layout are considered. (2)Despite this observation, all filling methods since 1998 minimize and evaluate density variation only with respect to a fixed dissection. This paper gives the first evaluation of existing filling algorithms with respect to "gridless" ("floating-window") mode, according to both the effective and spatial density models. Our experiments indicate surprising advantages of Monte-Carlo and greedy strategies over "optimal" linear programming (LP) based methods. Second, we suggest new, more relevant methods of measuring a local uniformity based on Lipschitz conditions, and empirically demonstrate that Monte-Carlo methods are inherently better than LP with respect to the new criteria. Finally, we propose new LP-based filling methods that are directly driven by the new criteria, and show that these methods indeed help close the "smoothness gap".
Starting Page	137
Ending Page	142
Page Count	6
File Format	PDF
ISBN	1581134606
DOI	10.1145/505388.505422
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2002-04-07
Publisher Place	New York
Access Restriction	Subscribed
Subject Keyword	Density analysis monte-carlo Dummy fill problem Vlsi manufacturability Chemical-mechanical polishing
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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