NDLI: Fuzzy control for enforcing energy efficiency in high-performance 3D systems

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Fidelity metrics for estimation models

Analysis and optimization of SRAM robustness for double patterning lithography

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Fuzzy control for enforcing energy efficiency in high-performance 3D systems

SimPL: an effective placement algorithm

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WISDOM: wire spreading enhanced decomposition of masks in double patterning lithography

An algorithm for exploiting modeling error statistics to enable robust analog optimization

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SMATO: simultaneous mask and target optimization for improving lithographic process window

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Unified analytical global placement for large-scale mixed-size circuit designs

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Flexible interpolation with local proof transformations

Power grid correction using sensitivity analysis

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Process variation aware performance modeling and dynamic power management for multi-core systems

Template-mask design methodology for double patterning technology

Unified theory of real-time task scheduling and dynamic voltage/frequency scaling on MPSoCs

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GLADE: a modern global router considering layer directives

Design space exploration and performance evaluation at electronic system level for NoC-based MPSoC

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Through-silicon-via management during 3D physical design: when to add and how many?

Recent research development in flip-chip routing

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Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip

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Fast statistical timing analysis of latch-controlled circuits for arbitrary clock periods

Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling

Timing yield optimization via discrete gate sizing using globally-informed delay PDFs

Boolean matching of function vectors with strengthened learning

New placement prediction and mitigation techniques for local routing congestion

Current shaping and multi-thread activation for fast and reliable power mode transition in multicore designs

Design-hierarchy aware mixed-size placement for routability optimization

Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system

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Analysis of precision for scaling the intermediate variables in fixed-point arithmetic circuits

Symbolic performance analysis of elastic systems

Early P/G grid voltage integrity verification

Multi-wafer virtual probe: minimum-cost variation characterization by exploring wafer-to-wafer correlation

Fast and lossless graph division method for layout decomposition using SPQR-tree

In-place decomposition for robustness in FPGA

Trace signal selection to enhance timing and logic visibility in post-silicon validation

Symbolic system level reliability analysis

Clustering-based simultaneous task and voltage scheduling for NoC systems

ESL solutions for low power design

Modeling and design for beyond-the-die power integrity

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Fast Poisson solvers for thermal analysis

Structured analog circuit design and MOS transistor decomposition for high accuracy applications

Synthesis of an efficient controlling structure for post-silicon clock skew minimization

Efficient state space exploration: interleaving stateless and state-based model checking

Characterization of the worst-case current waveform excitations in general RLC-model power grid analysis

Design dependent process monitoring for back-end manufacturing cost reduction

HW/SW co-design of parallel systems

Application-aware diagnosis of runtime hardware faults

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Polynomial datapath optimization using constraint solving and formal modelling

Fuzzy control for enforcing energy efficiency in high-performance 3D systems

Content Provider	ACM Digital Library
Author	Sabry, Mohamed M. Atienza, David Coskun, Ayse K.
Abstract	3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limiting factor in multitier systems. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3D architectures; however, liquid cooling brings new challenges in modeling and runtime management. This paper proposes a novel controller for improving energy efficiency and reliability in 3D systems through liquid cooling management and dynamic voltage frequency scaling (DVFS). The proposed fuzzy controller adjusts the liquid flow rate at runtime to match the cooling demand for preventing energy wastage of over-cooling and for maintaining a stable thermal profile. The DVFS decisions provide chip-level energy savings and help balancing the temperature across the system. Experimental results on 8- and 16-core multicore SoCs show that the controller prevents the system to exceed the given threshold temperature while reducing cooling energy by up to 50% and system-level energy by up to 21% in comparison to using a static worst-case flow rate setting.
Starting Page	642
Ending Page	648
Page Count	7
File Format	PDF
ISBN	9781424481927
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2010-11-07
Access Restriction	Subscribed
Content Type	Text
Resource Type	Article

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