NDLI: Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (OPSR, Vol. 38, Issue. 5)

Content Provider	ACM Digital Library
Author	Vijaykumar, T. N. Powell, Michael D. Gomaa, Mohamed
Abstract	Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of supply voltage and thermal ability of packages to dissipate heat. Power density is characterized by localized chip hot spots that can reach critical temperatures and cause failure. Previous architectural approaches to power density have used global clock gating, fetch toggling, dynamic frequency scaling, or resource duplication to either prevent heating or relieve overheated resources in a superscalar processor. Previous approaches also evaluate design technologies where power density is not a major problem and most applications do not overheat the processor. Future processors, however, are likely to be chip multiprocessors (CMPs) with simultaneously-multithreaded (SMT) cores. SMT CMPs pose unique challenges and opportunities for power density. SMT and CMP increase throughput and thus on-chip heat, but also provide natural granularities for managing power-density. This paper is the first work to leverage SMT and CMP to address power density. We propose heat-and-run SMT thread assignment to increase processor-resource utilization before cooling becomes necessary by co-scheduling threads that use complimentary resources. We propose heat-and-run CMP thread migration to migrate threads away from overheated cores and assign them to free SMT contexts on alternate cores, leveraging availability of SMT contexts on alternate CMP cores to maintain throughput while allowing overheated cores to cool. We show that our proposal has an average of 9% and up to 34% higher throughput than a previous superscalar technique running the same number of threads.
Starting Page	260
Ending Page	270
Page Count	11
File Format	PDF
ISSN	01635980
DOI	10.1145/1037949.1024424
Journal	ACM SIGOPS Operating Systems Review (OPSR)
Volume Number	38
Issue Number	5
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	1975-04-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Power density Heat Migration Cmp Smt
Content Type	Text
Resource Type	Article
Subject	Computer Networks and Communications Hardware and Architecture Information Systems

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (CARN, Vol. 32, Issue. 5)

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (SIGP, Vol. 39, Issue. 11)

Heat-and-run: leveraging SMT and CMP to manage power density through the operating system

Spatial computation (OPSR, Vol. 38, Issue. 5)

Deconstructing storage arrays (OPSR, Vol. 38, Issue. 5)

Computation spreading:employing hardware migration to specialize CMP cores on-the-fly (OPSR, Vol. 40, Issue. 5)

The Rio file cache:surviving operating system crashes (OPSR, Vol. 30, Issue. 5)

Impact of virtualization on computer architecture and operating systems (OPSR, Vol. 40, Issue. 5)

An analysis of operating system behavior on a simultaneous multithreaded architecture (OPSR, Vol. 34, Issue. 5)

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (OPSR, Vol. 38, Issue. 5)

Similar Documents

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (CARN, Vol. 32, Issue. 5)

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (SIGP, Vol. 39, Issue. 11)

Heat-and-run: leveraging SMT and CMP to manage power density through the operating system

Spatial computation (OPSR, Vol. 38, Issue. 5)

Deconstructing storage arrays (OPSR, Vol. 38, Issue. 5)

Computation spreading:employing hardware migration to specialize CMP cores on-the-fly (OPSR, Vol. 40, Issue. 5)

The Rio file cache:surviving operating system crashes (OPSR, Vol. 30, Issue. 5)

Impact of virtualization on computer architecture and operating systems (OPSR, Vol. 40, Issue. 5)

An analysis of operating system behavior on a simultaneous multithreaded architecture (OPSR, Vol. 34, Issue. 5)

Heat-and-run:leveraging SMT and CMP to manage power density through the operating system (OPSR, Vol. 38, Issue. 5)