NDLI: Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors

Content Provider	ACM Digital Library
Author	Yuan, Yuan Wang, Hai Tan, Sheldon X.-D. Gupta, Ashish Li, Duo
Copyright Year	2013
Abstract	Efficient temperature estimation is vital for designing thermally efficient, lower power and robust integrated circuits in nanometer regime. Thermal simulation based on the detailed thermal structures no longer meets the demanding tasks for efficient design space exploration. The compact and composable model-based simulation provides a viable solution to this difficult problem. However, building such thermal models from detailed thermal structures was not well addressed in the past. In this article, we propose a new compact thermal modeling technique, called $\textit{ThermComp},$ standing for thermal modeling with composable modules. $\textit{ThermComp}$ can be used for fast thermal design space exploration for multicore microprocessors. The new approach builds the composable model from detailed structures for each basic module using the finite difference method and reduces the model complexity by the sampling-based model order reduction technique. These composable models are then used to assemble different multicore architecture thermal models and realized into SPICE-like netlists. The resulting thermal models can be simulated by the general circuit simulator SPICE. $\textit{ThermComp}$ tries to preserve the accuracy of fine-grained models with the speed of coarse-grained models. Experimental results on a number of multicore microprocessor architectures show the new approach can easily build accurate thermal systems from compact composable models for fast architecture thermal analysis and optimization and is much faster than the existing HotSpot method with similar accuracy.
Starting Page	1
Ending Page	27
Page Count	27
File Format	PDF
ISSN	10844309
e-ISSN	15577309
DOI	10.1145/2442087.2442099
Volume Number	18
Issue Number	2
Journal	ACM Transactions on Design Automation of Electronic Systems (TODAES)
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2013-04-11
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Composable Model reduction Multicore Thermal modeling
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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