NDLI: Comparison of Single-Step Recovery Anneal Processing and a Single-Step Recrystallization Processing on the Generation of Special Boundaries in Commercially Pure Nickel

Please wait, while we are loading the content...

Comparison of Single-Step Recovery Anneal Processing and a Single-Step Recrystallization Processing on the Generation of Special Boundaries in Commercially Pure Nickel

Quantitative Fractographic Analysis of Variability in the Tensile Ductility of a High Strength Dual-Phase Steel

Influence of Cooling Rate and Aging on the Lamellar Microstructure and Fractography of TC21 Titanium Alloy

International Metallographic Contest and Exhibit : Co-Sponsored by the International Metallographic Society and ASM International. Deadline for entries is July 20, 2013.

A Message from an Old Master : Phlogiston and the Hardening of Steel

Light Microscopy Subject Guide

Can You Identify the Microstructure? ( Metallography, Microstructure, and Analysis , Volume 2 , Issue 1 )

Metallography, Microstructure, and Analysis : Volume 1

Comparison of Single-Step Recovery Anneal Processing and a Single-Step Recrystallization Processing on the Generation of Special Boundaries in Commercially Pure Nickel

Content Provider	Springer Nature Link
Author	Li, Qiangyong Richards, N. L.
Copyright Year	2012
Abstract	The strain recovery route to generate a significant increase in special boundaries nominally involves a strain level of less than about 10%, plus a recovery anneal at a temperature–time combination sufficient to cause grain boundary migration, but insufficient cold work/time/temperature combinations to cause recrystallization of the material being processed. In the present communication using a simple material to avoid complications from industrial alloys, commercially pure (C.P.) Ni was processed using a single low strain value of 6% and a temperature of 800–1000 °C for time up to 38 min. The fraction of special grain boundaries, F $_{sp}$, based on a Σ3–29 as evaluated by Orientation Image Microscopy was then compared with the as-received C.P. Ni and Ni strained 25% and annealed at 800 °C to give a recrystallized structure. For the single low strain route, a 6% deformation at a temperature of 800 °C and a time of 8–10 min resulted in an F $_{sp}$ value of close to 80%, as well as a grain size of about 25–35 μm compared to the as-received value of about 25 μm. Thus, while grain boundary migration occurred under these processing conditions, the increase in grain size was not excessive and would not result in a large reduction in tensile properties. The single 25% rolled and 800 °C recrystallized test samples however resulted in no major increase in F $_{sp}$ relative to the as-received material, both being in the range 35–40% over a range of times. Therefore, compared to the optimized F $_{sp}$ low strain recovery values of close to 80%, the fully recrystallized F $_{sp}$ values were approximately half. It should be noted however that multiple cycles of higher strain values rather than a single strain value, coupled with a recrystallized anneal, have been shown in the literature to result in increase in the F $_{sp}$ levels.
Starting Page	21
Ending Page	29
Page Count	9
File Format	PDF
ISSN	21929262
Journal	Metallography, Microstructure, and Analysis
Volume Number	2
Issue Number	1
e-ISSN	21929270
Language	English
Publisher	Springer-Verlag
Publisher Date	2012-12-12
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Grain boundary engineering Thermo-mechanical processing Orientation image microscopy Nickel Metallic Materials Characterization and Evaluation of Materials Structural Materials Surfaces and Interfaces, Thin Films Nanotechnology
Content Type	Text
Resource Type	Article
Subject	Metals and Alloys

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Influence of Anneal Time on Σ3 Boundary Segregation in Commercially Pure Nickel

Modeling Grain Boundary Motion and Dynamic Recrystallization in Pure Metals

Impurity (Fe, Cl, and P)-Induced Grain Boundary and Secondary Phases in Commercially Pure Titanium (CP-Ti)

Grain refining efficiency and mechanism of pure nickel

Effect of compression direction on the dynamic recrystallization behavior of continuous columnar-grained CuNi10Fe1Mn alloy

Delineation of Prior Austenite Grain Boundaries in a Low-Alloy High-Performance Steel

Understanding the Effect of Grain Boundary Character on Dynamic Recrystallization in Stainless Steel 316L

Detection of an Intermediate Layer Containing a Rhenium-Rich Particle at Grain Boundaries Formed Within Single Crystal Nickel-Based Superalloys

A New Metallographic Technique for Revealing Grain Boundaries in Aluminum Alloys

Comparison of Single-Step Recovery Anneal Processing and a Single-Step Recrystallization Processing on the Generation of Special Boundaries in Commercially Pure Nickel

Similar Documents

Influence of Anneal Time on Σ3 Boundary Segregation in Commercially Pure Nickel

Modeling Grain Boundary Motion and Dynamic Recrystallization in Pure Metals

Impurity (Fe, Cl, and P)-Induced Grain Boundary and Secondary Phases in Commercially Pure Titanium (CP-Ti)

Grain refining efficiency and mechanism of pure nickel

Effect of compression direction on the dynamic recrystallization behavior of continuous columnar-grained CuNi10Fe1Mn alloy

Delineation of Prior Austenite Grain Boundaries in a Low-Alloy High-Performance Steel

Understanding the Effect of Grain Boundary Character on Dynamic Recrystallization in Stainless Steel 316L

Detection of an Intermediate Layer Containing a Rhenium-Rich Particle at Grain Boundaries Formed Within Single Crystal Nickel-Based Superalloys

A New Metallographic Technique for Revealing Grain Boundaries in Aluminum Alloys

Comparison of Single-Step Recovery Anneal Processing and a Single-Step Recrystallization Processing on the Generation of Special Boundaries in Commercially Pure Nickel