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Electrical characterization of anodic alumina substrate with via-in-pad structure

Content Provider	Springer Nature Link
Author	Kim, Moonjung
Copyright Year	2013
Abstract	An anodic alumina substrate has been developed as a package substrate for dynamic random access memory devices. Unlike the conventional package substrates commonly made by laminating an epoxy-based core and cladding with copper, this substrate is fabricated using aluminum anodization technology. The anodization process produces a thick aluminum oxide layer on the aluminum substrate to be used as a dielectric layer. Placing copper patterns on the anodic aluminum oxide layer forms a new substrate structure that consists of a layered structure of aluminum, anodic aluminum oxide, and copper. Using selective anodization in the fabrication process, a via structure connecting the top copper layer and bottom aluminum layer is demonstrated. Additionally, by putting vias directly in the bond and ball pads in the substrate design, the via-in-pad structure is applied in this work. These two-layer metal structures and via-in-pad arrangements make routing easier and thus provide more design flexibility. Additionally, this new package substrate has improved the power distribution network impedance given the characteristics of these structures.
Starting Page	65
Ending Page	70
Page Count	6
File Format	PDF
ISSN	17388090
Journal	Electronic Materials Letters
Volume Number	9
Issue Number	1
e-ISSN	20936788
Language	English
Publisher	Springer Netherlands
Publisher Date	2013-10-10
Publisher Place	Dordrecht
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	DRAM package aluminum anodization via-in-pad structure transmission line S-parameter power distribution network impedance Optical and Electronic Materials Condensed Matter Physics Nanotechnology and Microengineering Characterization and Evaluation of Materials Nanotechnology
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials

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