NDLI: Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time

Content Provider	Springer Nature Link
Author	Sona, Mrunali Narayan Prabhu, K.
Copyright Year	2015
Abstract	Solder joint directly interfaces electrically, mechanically and thermally with numerous electronic components in electronic assemblies. Sn–Ag–Cu lead-free solder alloys for electronic assembly are being driven by the environmental issues concerning the toxicity of lead. In the present study, spreading behaviour, evolution of intermetallic compounds during solidification of Sn–0.3Ag–0.7Cu solder alloy on Ni coated Cu substrate and the related joint strength were studied as a function of reflow time. Experiments were carried out for various reflow times of 10, 100, 300 and 500 s at a reflow temperature of 270 °C. The solder alloy exhibited improvement in wettability on the substrate at longer reflow times. An increase in the IMC (CuNi)$_{6}$Sn$_{5}$ thickness was observed for samples reflowed up to 300 s and the thickness decreased for samples reflowed for 500 s. IMC layer formed were about 0.3, 1.15, 2.03, 1.94 μm during 10, 100, 300 and 500 s of reflow time respectively. The joint shear test was performed to assess the integrity of the Sn–0.3Ag–0.7Cu solder solidified on Cu substrates. The maximum joint strength was observed for samples reflowed for 100 s.
Starting Page	1027
Ending Page	1031
Page Count	5
File Format	PDF
ISSN	09722815
Journal	Transactions of the Indian Institute of Metals
Volume Number	68
Issue Number	6
e-ISSN	09751645
Language	English
Publisher	Springer India
Publisher Date	2015-09-11
Publisher Place	New Delhi
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solders Spreading behaviour Reflow time Joint reliability Metallic Materials Materials Science Tribology, Corrosion and Coatings
Content Type	Text
Resource Type	Article
Subject	Metals and Alloys

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