NDLI: Investigation on the interface of Cu/Al couples during isothermal heating

Content Provider	Springer Nature Link
Author	Han, Yan qiu Ben, Li hua Yao, Jin jin Feng, Shu wei Wu, Chun jing
Copyright Year	2015
Abstract	The evolutionary process and intermetallic compounds of Cu/Al couples during isothermal heating at a constant bonding temperature of 550°C were investigated in this paper. The interfacial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and Al at 550°C in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu$_{9}$Al$_{4}$, CuAl, CuAl$_{2}$, and α-Al + CuAl$_{2}$. Furthermore, these results provide new insights into the mechanism of the interfacial reaction between Cu and Al. Microhardness measurements show that the chemical composition exerts a significant influence on the mechanical properties of Cu/Al couples.
Starting Page	309
Ending Page	318
Page Count	10
File Format	PDF
ISSN	16744799
Journal	International Journal of Minerals, Metallurgy, and Materials
Volume Number	22
Issue Number	3
e-ISSN	1869103X
Language	English
Publisher	University of Science and Technology Beijing
Publisher Date	2015-03-04
Publisher Place	Beijing
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	copper aluminum intermetallic compounds oxide films isothermal heating Materials Science Metallic Materials Characterization and Evaluation of Materials Ceramics, Glass, Composites, Natural Methods Surfaces and Interfaces, Thin Films Tribology, Corrosion and Coatings
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Mechanics of Materials Metals and Alloys Geochemistry and Petrology Mechanical Engineering

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