NDLI: Design and fabrication of printed electrowetting-on-dielectric device

Content Provider	Springer Nature Link
Author	Kim, Bongmin Lee, Seung Jun Kim, Inyoung Lee, Taik Min
Copyright Year	2015
Abstract	Due to the expensive price of the fabrication process of the existing semiconductor technology, printing technology has become the center of much attention in research as a micro fabrication technology. Among printing technologies, the rReverse-offset-printing (ROP) method that can achieve high resolution and complicated shape patterns is utilized to fabricate the electrowetting-on-dielectric (EWOD) device, which has been widely researched for the control small-scale droplets. The EWOD device consists of three-layers which were successfully fabricated by the solution-based process. As a metal layer, Ag-ink was printed on the glass substrate by the ROP method. On top of this layer, a polymer solution (polyvinylphenol, PVP) was spin-coated as a dielectric layer, which has a high dielectric strength (100 V/mm) and high dielectric constant (3.9) compared to other spin-coatable dielectric materials. The Teflon solution was spin-coated on top of the dielectric layer to deposit a hydrophobic surface. Using the printed EWOD device, the transport of micro-size droplets was successfully demonstrated.
Starting Page	989
Ending Page	995
Page Count	7
File Format	PDF
ISSN	22347593
Journal	International Journal of Precision Engineering and Manufacturing
Volume Number	16
Issue Number	5
e-ISSN	20054602
Language	English
Publisher	Korean Society for Precision Engineering
Publisher Date	2015-05-15
Publisher Place	Seoul
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	EWOD Eelectrowetting Electrowetting-on-dielectric Printed EWOD Printed electronics Industrial and Production Engineering Materials Science
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Mechanical Engineering Electrical and Electronic Engineering

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