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  1. International Journal of Precision Engineering and Manufacturing
  2. International Journal of Precision Engineering and Manufacturing : Volume 12
  3. International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 1, February 2011
  4. Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel
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International Journal of Precision Engineering and Manufacturing : Volume 18
International Journal of Precision Engineering and Manufacturing : Volume 17
International Journal of Precision Engineering and Manufacturing : Volume 16
International Journal of Precision Engineering and Manufacturing : Volume 15
International Journal of Precision Engineering and Manufacturing : Volume 14
International Journal of Precision Engineering and Manufacturing : Volume 13
International Journal of Precision Engineering and Manufacturing : Volume 12
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 6, December 2011
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 5, October 2011
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 4, August 2011
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 3, June 2011
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 2, April 2011
International Journal of Precision Engineering and Manufacturing : Volume 12, Issue 1, February 2011
Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel
Cusp error reduction under high speed micro/meso- scale milling with ultrasonic vibration assistance
Haptic-based resistance training machine and its application to biceps exercises
Brake performance evaluation of ABS with sliding mode controller on a split road with driver model
Improvement of temperature accuracy in oil cooler systems with gas bypass
Effect of hydrophobic ionic liquid loading on characteristics and electromechanical performance of cellulose
Integrated numerical analysis to evaluate replication characteristics of micro channels in a locally heated mold by selective induction
Computer-aided porous scaffold design for tissue engineering using triply periodic minimal surfaces
Design of U-shape milled groove conformal cooling channels for plastic injection mold
A study on the ballistic damage tolerance design of aircraft structure from armor piercing bullet hits
Piezoelectric actuators for the correction of optical ray path in the operation of laser gyros
An experimental study and finite element analysis of weatherstrip
Prediction of heating-line paths in induction heating process using the artificial neural network
A compact ultra-precision air bearing stage with 3-DOF planar motions using electromagnetic motors
Investigation of cutting parameters effect for minimization of sur face roughness in internal turning
Intact hip and knee joint moment in coronal plane with unilateral transfemoral amputee
Impact of traffic environment and cognitive workload on older drivers’ behavior in simulated driving
The study of gender differences in physiological variables upon irradiation of therapeutic ultrasound
Chemical mechanical planarization of copper bumps on printed circuit board
Continuous functional analysis for axiomatic design
Polygon-based 3D surgical planning system for hip operation
Fabrication and measurement of the performance of a printed EMI shielding mesh filter on PET film
Micro-patterning on non-planar surface using flexible microstencil
Comparison of gait and cognitive function among the elderly with Alzheimer’s Disease, Mild Cognitive Impairment and Healthy
International Journal of Precision Engineering and Manufacturing : Volume 11
International Journal of Precision Engineering and Manufacturing : Volume 10

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Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel

Content Provider Springer Nature Link
Author Zhao, Qingliang Chen, Junyun Huang, Haitao Fang, Xiaoyan
Copyright Year 2011
Abstract Coarse-grained wheels can realize high efficient grinding of optical glass. However, the serious surface and subsurface damage will be inevitably introduced by the coarse-grained wheels. In this paper, the grinding damage of a copper-resin bond coarse-grained diamond wheel with grain size of 150μm was investigated on optical glass BK7. The wheel was first properly trued with a metal bond diamond wheel, then pre-dressing for the wheel and grinding experiments are carried out on a precision grinder assisted with electrolytic in process dressing (ELID) method. The surface roughness (Ra) of ground surface was measured using an atomic force microscope (AFM) and the surface topography were imaged by a white light interferometer (WLI) and the AFM. The subsurface damage level of ground surface was evaluated by means of both MRF spot method and taper polishing-etching method, in term of the biggest depth of subsurface damage, distribution of micro defects beneath the ground surface, the cluster depth of subsurface damage, relationship between subsurface damage (SSD) and PV surface roughness (SR), propagating distance and pattern of cracks beneath the ground surface. Experimental results indicate that a well conditioned copper-resin bond coarse-grained diamond wheel on a precision grinder can generate good surface quality of Ra less than 50nm and good subsurface integrity with SSD depth less than 3.5ε for optical glass BK7.
Starting Page 5
Ending Page 13
Page Count 9
File Format PDF
ISSN 12298557
Journal International Journal of Precision Engineering and Manufacturing
Volume Number 12
Issue Number 1
e-ISSN 20054602
Language English
Publisher Korean Society for Precision Engineering
Publisher Date 2011-02-04
Publisher Place Springer
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Grinding Optical glass BK7 Surface and subsurface damage Coarse-grained diamond wheel Copper-resin bond wheel Materials Science Industrial and Production Engineering
Content Type Text
Resource Type Article
Subject Industrial and Manufacturing Engineering Mechanical Engineering Electrical and Electronic Engineering
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