NDLI: Effect of bonding temperatures on the transient liquid phase bonding of a directionally solidified Ni-based superalloy, GTD-111

Content Provider	Springer Nature Link
Author	Lee, Bong Keun Song, Woo Young Kim, Dae Up Woo, In Su Kang, Chung Yun
Copyright Year	2007
Abstract	The bonding phenomenon and the mechanism involved in the transient liquid phase bonding (TLP Bonding) of directionally solidified Ni-based superalloy GTD-111 was investigated. At a bonding temperature of 1403 K, the liquid insert metal was eliminated by isothermal solidification, which was controlled by the diffusion of B and Si into the base metal. The solids in the bonded interlayer simultaneously grew epitaxially from the mating base metal inward from the insert metal. The number of grain boundaries formed at the bonded interlayer corresponded with those of the base metal. Liquefaction at the grain boundary and dendrite boundary occurred at a temperature of 1433 K. At a bonding temperature of 1453 K which is higher than the liquefaction temperature of the grain boundary, liquids of the insert metal were connected with liquated grain boundaries; this connection extended as far as the grain boundary, which was approximately 1.5 mm from the interface. The composition of this liquid was a mixture of the insert metal and phase that existed at the grain boundary. At extended holding times, liquid phases gradually decreased, and liquids with a continuous band shape develop into distinct islands. However, the liquid phases did not disappear after a holding period of 7.2 ks at 1453K. The extended isothermal solidification process at the bonding temperature, which is higher than the liquefaction temperature for the grain boundary, was controlled by the diffusion of Ti. This resulted in its preferential liquefaction compared to B or Si in the insert metal.
Starting Page	59
Ending Page	65
Page Count	7
File Format	PDF
ISSN	15989623
Journal	Metals and Materials
Volume Number	13
Issue Number	1
Language	English
Publisher	The Korean Institute of Metals and Materials
Publisher Date	2007-01-01
Publisher Place	Seoul
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	GTD-111 directionally solidified superalloy transient liquid phase bonding bonding mechanism isothermal solidification Metallic Materials Operating Procedures, Materials Treatment Magnetism, Magnetic Materials Engineering Thermodynamics, Heat and Mass Transfer Characterization and Evaluation of Materials Continuum Mechanics and Mechanics of Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Mechanics of Materials Metals and Alloys Condensed Matter Physics

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