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Reaction properties and interfacial intermetallics for Sn−xAg−0.5Cu solders as a function of Ag content

Content Provider	Springer Nature Link
Author	Lee, Jong Hyun Yu, A Mi Kim, Jeong Han Kim, Mok Soon Kang, Namhyun
Copyright Year	2008
Abstract	Wetting and interfacial reactions were investigated for Sn−xAg−0.5Cu alloys, in which the Ag content had a variation from x=1.0 to x=4.0. Differential scanning calorimetry (DSC) was used to investigate the range of the melting temperature and the solidification temperature by measuring the endothermic and the exothermic heat flow, respectively. Low Ag contents increased the melting temperature ranges and deteriorated the wetting properties such as zero cross time and wetting force measured at two seconds. The extent of undercooling increased and the thickness of intermetallic compounds (IMC) decreased as the Ag content decreased. As the Ag content decreased, the initial IMC thickness decreased due to the large undercooling and, during the solid aging at 170°C, the IMC growth slightly decelerated because of the small diffusion coefficient. For the application of good drop shock reliability, Sn−Ag−Cu solder of low Ag content should be beneficial due to the restraint of the IMC growth (Cu$_{6}$Sn$_{5}$ and Cu$_{3}$Sn) and of the coarse plate-like IMC (Ag$_{3}$Sn).
Starting Page	649
Ending Page	654
Page Count	6
File Format	PDF
ISSN	15989623
Journal	Metals and Materials
Volume Number	14
Issue Number	5
Language	English
Publisher	The Korean Institute of Metals and Materials
Publisher Date	2008-01-01
Publisher Place	Seoul
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Pb-free solder Sn−Ag−Cu alloy wetting undercooling intermetallic compound (IMC) Metallic Materials Operating Procedures, Materials Treatment Magnetism, Magnetic Materials Engineering Thermodynamics, Heat and Mass Transfer Characterization and Evaluation of Materials Continuum Mechanics and Mechanics of Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Mechanics of Materials Metals and Alloys Condensed Matter Physics

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