NDLI: Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection

Content Provider	Springer Nature Link
Author	Kim, Jong Woong Lee, Young Chul Jung, Seung Boo
Copyright Year	2008
Abstract	This paper presents an investigation on the conduction behaviors of the anisotropic conductive film (ACF) interconnections bonded at various bonding forces. The connection resistance of the ACF joints decreased with increasing bonding force up to 70 N, but subsequently converged to a value of 10 mΩ at bonding forces above 70N. This convergence of the connection resistance in the ACF joints was due to two opposing factors: decreased resistance due to increased contact area and increased resistance due to decreased currentflow path that may have been affected by the delamination of the metal film from the polymeric cores at high bonding forces. During thermal shock testing of the adhesive joints, two different conduction behaviors were observed: increasing connection resistance and the termination of Ohmic behavior. The former was due to decreased contact areas caused by warpage of the package, whereas the latter was caused by delamination at the interface.
Starting Page	373
Ending Page	379
Page Count	7
File Format	PDF
ISSN	15989623
Journal	Metals and Materials
Volume Number	14
Issue Number	3
Language	English
Publisher	The Korean Institute of Metals and Materials
Publisher Date	2008-01-01
Publisher Place	Seoul
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	anisotropic conductive film conduction mechanism thermal shock connection resistance flip chip Metallic Materials Operating Procedures, Materials Treatment Magnetism, Magnetic Materials Engineering Thermodynamics, Heat and Mass Transfer Characterization and Evaluation of Materials Continuum Mechanics and Mechanics of Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Mechanics of Materials Metals and Alloys Condensed Matter Physics

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Flip-chip process using heat transfer from an induction-heating film

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

Stiffness effect of conductive composite powder on electrical properties of ACF for FPD

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Bonding strength in structural adhesive bonded joint

Characterization of Al/crystallized Al-based metallic glass composites produced by repeated roll bonding process

Thermomechanical and martensitic transformation stresses of NiTiJSi thin film composites

Retraction Note

Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection

Similar Documents

Flip-chip process using heat transfer from an induction-heating film

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

Stiffness effect of conductive composite powder on electrical properties of ACF for FPD

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Bonding strength in structural adhesive bonded joint

Characterization of Al/crystallized Al-based metallic glass composites produced by repeated roll bonding process

Thermomechanical and martensitic transformation stresses of NiTiJSi thin film composites

Retraction Note

Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection