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Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions

Content Provider	Springer Nature Link
Author	Yang, Kyoung Chun Lee, Seong Hyuk Kim, Jong Min Choi, Young Ki Farson, Dave F. Shin, Young Eui
Copyright Year	2009
Abstract	The interfacial reaction between Cu pad coated with Au/Ni and solder bump of flip chip package, using Sn97.5wt.%-Ag2.5wt%, was studied under thermal shock stress. All joints were subjected to thermal shock test with −65°C/+150°C temperature range. For the Sn-2.5Ag solder, a scallop-like (Cu,Ni)$_{6}$Sn$_{5}$ intermetallic compound was formed in the solder matrix after 20 cycles of thermal shock. (Cu,Ni)$_{6}$Sn$_{5}$ was detached from the interface as (Ni,Cu)$_{3}$Sn$_{4}$ grew underneath the (Cu,Ni)$_{6}$Sn$_{5}$ IMC(Intermetallic Compound), whereas the elements of Sn, Ni and Cu were moved by interdiffusion at the interface between solder alloy and Cu pad. The composition of the IMCs in the solder joints and elemental distribution across the joint interfaces were quantitatively measured with EPMA (electron probe micro analysis). Finally, it was found that the crack initiation point and its propagation path could be influenced by the thermal shock conditions, two underfills, and their properties.
Starting Page	435
Ending Page	441
Page Count	7
File Format	PDF
ISSN	1738494X
Journal	Journal of Mechanical Science and Technology
Volume Number	23
Issue Number	2
e-ISSN	19763824
Language	English
Publisher	Korean Society of Mechanical Engineers
Publisher Date	2010-04-16
Publisher Place	Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Intermetallic compound Lead-free solder Flip chip Reliability Industrial and Production Engineering Vibration, Dynamical Systems, Control Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Mechanical Engineering

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