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| Content Provider | Springer Nature Link |
|---|---|
| Author | Kim, Mi Ro Choi, Young Ki Lee, Gyu Bong Chung, Il Yong Kim, Jung Duck Lee, Jung Hee |
| Copyright Year | 1998 |
| Abstract | A two-dimensional numerical model for an infrared reflow soldering with a convection fan is used my modifying the Eftychiou’s numerical modeling. The two-dimensional tunnel model which predicts convective conditions within the reflow oven are solved using the finite volume method with the SIMPLER algorithm. The card model solves the transient two-dimensional heat conduction equation in conjunction with a radiative heat transfer analysis. We also performed an experiment to validate the numerical modeling. The numerical result shows excellent agreement with experimental data. Based on the capability of this model, parametric simulations are performed to determine the thermal response of the solder to variations in the oven operating conditions and heat transfer conditions. This study shows that radiation and conveyor velocity are important factors in the preheat region. |
| Starting Page | 972 |
| Ending Page | 979 |
| Page Count | 8 |
| File Format | |
| ISSN | 1738494X |
| Journal | Journal of Mechanical Science and Technology |
| Volume Number | 12 |
| Issue Number | 5 |
| Language | English |
| Publisher | Korean Society of Mechanical Engineers |
| Publisher Date | 1998-01-01 |
| Publisher Place | Seoul |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Infrared Reflow Oven Convection Fan Card Model Tunnel Model Soldering Finite Volume Method Mechanical Engineering Vibration, Dynamical Systems, Control Industrial and Production Engineering |
| Content Type | Text |
| Resource Type | Article |
| Subject | Mechanics of Materials Mechanical Engineering |
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