NDLI: Optimization of rapid thermal processing for uniform temperature distribution on wafer surface

Content Provider	Springer Nature Link
Author	Oh, Hyuck Keun Kang, Sae Byul Choi, Young Ki Lee, Joon Sik
Copyright Year	2009
Abstract	An optimization of rapid thermal processing (RTP) was conducted to obtain uniform temperature distribution on a wafer surface by using linear programming and radiative heat transfer modeling. The results show that two heating lamp zones are needed to maintain uniform wafer temperature and the optimal lamp positions are unique for a given geometry and not affected by wafer temperatures. The radii of heating lamps, which were obtained by optimization, are 45 mm and 108 mm. The emissivity and temperature of the chamber wall do not significantly affect the optimal condition. With obtained optimum geometry of the RTP chamber and lamp positions, the wafer surface temperatures were calculated. The uniformity allowance of the wafer surface is less than ±1°C when the mean temperature of the wafer surface is 1000°C.
Starting Page	1544
Ending Page	1552
Page Count	9
File Format	PDF
ISSN	1738494X
Journal	Journal of Mechanical Science and Technology
Volume Number	23
Issue Number	6
e-ISSN	19763824
Language	English
Publisher	Korean Society of Mechanical Engineers
Publisher Date	2010-04-17
Publisher Place	Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Linear programming Optimization Rapid thermal processing Uniform wafer temperature Industrial and Production Engineering Vibration, Dynamical Systems, Control Mechanical Engineering
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Mechanical Engineering

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