NDLI: Growth and characterization of MMA/SiO$_{2}$ hybrid low-k thin films for interlayer dielectric applications

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Growth and characterization of MMA/SiO$_{2}$ hybrid low-k thin films for interlayer dielectric applications

Content Provider	Springer Nature Link
Author	Joshi, Bhavana N. More, M. A. Mahajan, A. M.
Copyright Year	2010
Abstract	The methylmethacrylate (MMA) incorporated SiO$_{2}$ thin films having low dielectric constant (k = 2.97) were deposited successfully to realize new interlayer material for the enhancement of electrical performance of on-chip wiring in very large scale integrated (VLSI) circuits. We have successfully incorporated MMA monomer and eliminated the polymerization step to lower the dielectric constant of deposited thin film. The presence of peak of C=C bond in Fourier transform infrared (FTIR) spectra and carbon peak in energy dispersive (EDAX) spectra confirms the incorporation of carbon in the film due to MMA. The concentration of MMA has great impact on the peak area and full width at half maxima (FWHM) of the Si-O-Si bond, which decreases the density by low atomic weight elements and consequently decreases the dielectric constant. The surface morphology analysed by scanning electron microscopic (SEM) image shows excellent uniformity of the film. The refractive index of 1.31 was measured by ellipsometer for 0.5 ml MMA concentration film. These deposited thin films having low refractive index and dielectric constant are widely applicable for the optical interconnects and interlayer applications in integrated optical circuits and VLSI circuits.
Starting Page	197
Ending Page	201
Page Count	5
File Format	PDF
ISSN	02504707
Journal	Bulletin of Materials Science
Volume Number	33
Issue Number	3
e-ISSN	09737669
Language	English
Publisher	Springer-Verlag
Publisher Date	2010-10-01
Publisher Institution	Indian Academy of Sciences
Publisher Place	India
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	MMA incorporation low refractive index low dielectric constant optical interconnects interlayer applications Engineering Materials Science
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Materials Science

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