NDLI: Recent advances in modulated pulsed power magnetron sputtering for surface engineering

Content Provider	Springer Nature Link
Author	Lin, Jianliang Sproul, William D. Moore, John J. Wu, Zhili Lee, Sabrina Chistyakov, Roman Abraham, Bassam
Copyright Year	2011
Abstract	Over the past 10 years, the development of high-power pulsed magnetron sputtering (HPPMS) has shown considerable potential in improving the quality of sputtered films by generating a high degree of ionization of the sputtered species to achieve high plasma density by using pulsed, high peak target power for a short period of time. However, the early HPPMS technique showed a significantly decreased deposition rate as compared to traditional magnetron sputtering. Recently, an alternative HPPMS deposition technique known as modulated pulsed power (MPP) magnetron sputtering has been developed. This new sputtering technique is capable of producing a high ionization fraction of sputter target species and while at the same time achieving a high deposition rate. This paper is aimed at giving a review of recent advances in the MPP technique in terms of the plasma properties, the improvements in the structure and properties of the thin films, and the important advances in the high rate deposition of high quality thick coatings on the order of 20–100 μm in thickness.
Starting Page	48
Ending Page	58
Page Count	11
File Format	PDF
ISSN	10474838
Journal	JOM
Volume Number	63
Issue Number	6
e-ISSN	15431851
Language	English
Publisher	Springer US
Publisher Date	2011-06-14
Publisher Institution	The Minerals, Metals & Materials Society (TMS)
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Engineering Physics Environment Chemistry/Food Science Earth Sciences Materials Science
Content Type	Text
Resource Type	Article
Subject	Engineering Materials Science

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