NDLI: Low-thermal-expansion copper composites via negative CTE metallic elements

Content Provider	Springer Nature Link
Author	Jin, S. Mavoori, H.
Copyright Year	1998
Abstract	Thermal management is an important issue in electronic packaging due to the increasing complexity, miniaturization, and high density of components in modern devices. In high-power-dissipation packages, heat sinks are essential for preventing thermal damage to heat-sensitive components on the silicon chip. However, commonly used heat-sink materials (e.g., copper and aluminum alloys) have a much higher coefficient of thermal expansion (CTE) than silicon. CTE mismatch between the various materials in an electronic package can lead to stresses that can trigger complex failure mechanisms like component distortion, stress rupture, thermomechanical fatigue, and creep, thereby seriously degrading device reliability and lifetime. Therefore, it is highly desirable to minimize the CTE mismatch by developing new heat-sink materials having CTEs that are close to the CTE of silicon. In this work, low-thermal-expansion copper composites with CTEs as low as 4 ppm/°C have been fabricated by employing a negative thermal-expansion alloy—equiatomic Ni-Ti, which has a CTE of approximately −21 ppm/°C. The use of negative CTE elements, especially those with very large negative CTE values, offers an attractive route for controlling the thermal-expansion behavior of various metallic and nonmetallic materials.
Starting Page	70
Ending Page	72
Page Count	3
File Format	PDF
ISSN	10474838
Journal	JOM
Volume Number	50
Issue Number	6
e-ISSN	15431851
Language	English
Publisher	Springer-Verlag
Publisher Date	1998-01-01
Publisher Institution	The Minerals, Metals & Materials Society (TMS)
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Materials Science Engineering Chemistry/Food Science Physics Environment Geosciences
Content Type	Text
Resource Type	Article
Subject	Engineering Materials Science

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