NDLI: Electroless deposition of NiMoP films using alkali-free chemicals for capping layers of copper interconnections

Content Provider	Springer Nature Link
Author	Lee, Hae Min Chae, Heeyeop Kim, Chang Koo
Copyright Year	2012
Abstract	NiMoP films were electrolessly deposited on copper substrates in a bath containing alkali-free chemicals. The film characteristics such as composition, thickness (or deposition rate), and microstructure were investigated by varying the concentration of the electrolyte. The film thickness increased with nickel ion concentration and decreased with increasing concentrations of either molybdate or hypophosphite ions. The nickel, molybdenum, and phosphorous content of the film increased as the concentrations of their corresponding precursors increased in the bath. Microstructural analysis showed that amorphous films formed when the combined content of molybdenum and phosphorous in the film was sufficiently high. Higher combined contents of molybdenum and phosphorous also improved the corrosion resistance of the film.
Starting Page	1259
Ending Page	1265
Page Count	7
File Format	PDF
ISSN	02561115
Journal	Korean Journal of Chemical Engineering
Volume Number	29
Issue Number	9
e-ISSN	19757220
Language	English
Publisher	Springer US
Publisher Date	2012-02-24
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	NiMoP Films Electroless Deposition Alkali-free Chemicals Amorphous Corrosion Resistance Materials Science Industrial Chemistry/Chemical Engineering Biotechnology Catalysis
Content Type	Text
Resource Type	Article
Subject	Chemistry Chemical Engineering

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Electroless deposition of NiMoP films using alkali-free chemicals for capping layers of copper interconnections