NDLI: Investigation of cleaning solution composed of citric acid and 5-aminotetrazole

Content Provider	Springer Nature Link
Author	Kwon, Oh Joong Bae, Jae Han Cho, Bum Koo Kim, Yung Jun Kim, Jae Jeong
Copyright Year	2011
Abstract	In a damascene process for a copper metallization, the planarization method based on a chemical mechanical polishing (CMP) has been used for multilevel metallization. Although a buffing step was adopted in this CMP process, numerous residual abrasives, capable of increasing the resistance of copper lines, still existed after the second CMP step. For this reason, more research has focused on identification of an effective cleaning solution. We investigated a new cleaning solution consisting of citric acid and 5-aminotetrazole (ATRA) as a complexing agent and corrosion inhibitor, respectively. The citric acid was added to achieve a lift-off effect by removing the underlying copper oxide layer, whereas the ATRA was adopted to prevent abrasive re-adsorption by forming a passivation layer on the copper surface. The cleaning solution consisting of 0.006 M citric acid and 0.006 M ATRA displayed a particle density of 0.07 #/μm$^{2}$ in an immersion test, and no particles were observed on a 4 cm$^{2}$ coupon wafer in a real process test at pH 12.
Starting Page	1619
Ending Page	1624
Page Count	6
File Format	PDF
ISSN	02561115
Journal	Korean Journal of Chemical Engineering
Volume Number	28
Issue Number	7
e-ISSN	19757220
Language	English
Publisher	Springer US
Publisher Date	2011-06-23
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Cleaning Solution Citric Acid 5-Aminotetrazole Particle Density Etch Rate Materials Science Industrial Chemistry/Chemical Engineering Biotechnology Catalysis
Content Type	Text
Resource Type	Article
Subject	Chemistry Chemical Engineering

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