NDLI: Effects of Adhesive Application Methods on Performance of a Soy-based Adhesive in Oriented Strandboard

Content Provider	Springer Nature Link
Author	Schwarzkopf, Matthew Huang, Jian Li, Kaichang
Copyright Year	2009
Abstract	A wet method and dry method of applying a soy flour (SF)–curing agent (CA) adhesive onto wood flakes were evaluated for making randomly oriented strandboard (R-OSB) and OSB. The wet method involved the thorough mixing of SF and CA prior to spraying the SF–CA mixture onto wood flakes. SF:CA weight ratio, adhesive add-on rate, hot-press conditions were optimized for enhancing internal bond strength (IB), modulus of rupture (MOR), and modulus of elasticity(MOE) of the resulting R-OSB. The highest IB, MOR and MOE were obtained at the 1:1 SF:CA weight ratio. IB, MOR and MOE of R-OSB exceeded the minimum industrial requirements at a ≥7% adhesive add-on rate, a hot-press temperature in the 170–220 °C range, and a ≥4 min hot-press time. The dry method involved spraying aqueous CA solution onto a mixture of SF and wood flakes. The dry method allowed the strengths of the resulting R-OSB to exceed the minimum industrial requirements at a higher SF:CA ratio (up to 7:1). The dry method was superior to the wet method because a higher SF:CA ratio meant a lower adhesive cost. OSBs made with the SF–CA adhesive had strengths higher than or comparable to commercial OSBs.
Starting Page	1001
Ending Page	1007
Page Count	7
File Format	PDF
ISSN	0003021X
Journal	Journal of the American Oil Chemists' Society
Volume Number	86
Issue Number	10
e-ISSN	15589331
Language	English
Publisher	Springer-Verlag
Publisher Date	2009-07-15
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Wood adhesives Soy flour Oriented strandboard Internal bond Biotechnology Food Science Agriculture Biomaterials Industrial Chemistry/Chemical Engineering
Content Type	Text
Resource Type	Article
Subject	Organic Chemistry Chemical Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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