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| Content Provider | Springer Nature Link |
|---|---|
| Author | Li, Dong ling Shang, Zheng guo Wang, Sheng qiang Wen, Zhi yu |
| Copyright Year | 2013 |
| Abstract | Manufacturing and integration of micro-electro-mechanical systems (MEMS) devices and integrated circuits (ICs) by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by O$_{2}$ plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by O$_{2}$ plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N$_{2}$ atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%–95% and the achieved surface energy is 1.76 J/m$^{2}$ when the bonded wafers are annealed at 350 °C in N$_{2}$ atmosphere for 2 h. Void formation was systematically observed and elimination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O$_{2}$ plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging. |
| Starting Page | 244 |
| Ending Page | 251 |
| Page Count | 8 |
| File Format | |
| ISSN | 18691951 |
| Journal | Journal of Zhejiang University SCIENCE C |
| Volume Number | 14 |
| Issue Number | 4 |
| e-ISSN | 1869196X |
| Language | English |
| Publisher | SP Zhejiang University Press |
| Publisher Date | 2013-04-10 |
| Publisher Place | Heidelberg |
| Access Restriction | Subscribed |
| Subject Keyword | Low temperature Wafer direct bonding O$_{2}$ plasma activation Surface energy Void formation Computer Science Electrical Engineering Computer Hardware Computer Systems Organization and Communication Networks Electronics and Microelectronics, Instrumentation Communications Engineering, Networks |
| Content Type | Text |
| Resource Type | Article |
| Subject | Engineering |
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