NDLI: Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives

Content Provider	Springer Nature Link
Author	Dai, Kai Zhu, Guangping Lu, Luhua Dawson, Graham
Copyright Year	2011
Abstract	Dendritic silver (Ag) nanoparticles have been successfully prepared by an easy and large scale liquid-phase reduction method. Transmission electron microscope (TEM), scanning electron microscope (SEM), and x-ray diffraction (XRD) have shown that the Ag particles prepared by this method are pure and with uniform dendritic morphology. The bulk resistivity and bonding strength of isotropic conductive adhesives (ICAs) filled with Ag nanodendrite and micrometer-sized Ag have been measured. The results show that the dendritic morphology of Ag nanoparticles has a strong effect for improving the reinforcement of the composite electrical performance. ICA filled with small amounts of Ag nanodendrites exhibits lower bulk resistivity and higher bonding strength than ICA filled with micrometer-sized Ag. When ICA is filled with 50 wt.% micrometer-sized Ag and 10 wt.% Ag nanodendrites, the bulk resistivity is 1.3 × 10$^{−4}$ Ω cm, and the bonding strength reaches 18.9 MPa.
Starting Page	353
Ending Page	357
Page Count	5
File Format	PDF
ISSN	10599495
Journal	Journal of Materials Engineering and Performance
Volume Number	21
Issue Number	3
e-ISSN	15441024
Language	English
Publisher	Springer US
Publisher Date	2011-04-05
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	bonding strength bulk resistivity conductive adhesive silver nanodendrite Characterization and Evaluation of Materials Materials Science Engineering Design Quality Control, Reliability, Safety and Risk Tribology, Corrosion and Coatings
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Materials Science Mechanical Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength

Interface Stress-Induced Degradation of the Performance of Electrically Conductive Adhesives

Reliability studies of an isotropic electrically conductive adhesive

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Evaluation of Advanced Adhesives for Aerospace Structures

Fabrication, Conductive Properties and Photocatalytic Application of Silver Nanorods

Printing Force Effect on Conductive Silver Tracks: Geometrical, Surface, and Electrical Properties

Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres

Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives

Similar Documents

Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength

Interface Stress-Induced Degradation of the Performance of Electrically Conductive Adhesives

Reliability studies of an isotropic electrically conductive adhesive

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Evaluation of Advanced Adhesives for Aerospace Structures

Fabrication, Conductive Properties and Photocatalytic Application of Silver Nanorods

Printing Force Effect on Conductive Silver Tracks: Geometrical, Surface, and Electrical Properties

Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres

Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives