NDLI: Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder

Content Provider	Springer Nature Link
Author	Yamaguchi, T. Ikeda, O. Oda, Y. Hata, S. Kuroki, K. Kuroda, H. Hirose, A.
Copyright Year	2015
Abstract	Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing Al oxidation. The effects of the bonding conditions on the bondability with Zn/Al/Zn clad solder were investigated. Bonding was achieved in the temperature range from 385°C to 420°C under N$_{2}$ atmosphere with oxygen concentration below 100 ppm. However, the bonding strength of the joint formed under N$_{2}$ + 4% H$_{2}$ atmosphere was almost 0 MPa, and stripe defects and air gaps remained in the bond layer. To improve the bondability under N$_{2}$ + 4% H$_{2}$ and expand the application range, a five-layer Cu/Zn/Al/Zn/Cu clad solder was developed in an attempt to prevent the Zn layers from being oxidized by the outer Cu layers. Cross-sectional observation of the Cu/Zn/Al/Zn/Cu clad solder revealed that the surface was covered by a Cu layer, and that Cu$_{5}$Zn$_{8}$ layers grew between the Cu and Zn layers. This clad solder exhibited high shear strength of over 80 MPa when formed under N$_{2}$ + 4% H$_{2}$ atmosphere, and no stripe defects or air gaps were observed in the bond layer.
Starting Page	4769
Ending Page	4778
Page Count	10
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	44
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2015-10-15
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Zn-Al solder Zn-Al-Cu solder Pb-free clad material eutectic melting die attachment Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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