NDLI: Influence of alloy composition on fillet-lifting phenomenon in Sn-Ag-Bi alloys

Content Provider	Springer Nature Link
Author	Takao, H. Hasegawa, H.
Copyright Year	2001
Abstract	The influence of the Bi content on the fillet-lifting phenomenon in Sn-3Ag-Bi alloys was investigated. The peculiar composition dependence on the fillet-lifting exists in Sn-3Ag-xBi alloys. With fillet-lifting, they are 3–20%Bi. Without fillet-lifting, they are 0–1%Bi, 30%Bi, and above. This is related to the alloy solidification characteristics, in particular, the amount of latent heat release near the final solidification temperature (solidus temperature) during solidification. Fillet-lifting is likely to occur in the alloy with a latent heat released which is insufficient for alleviation of the temperature gradient in the solder joint. A new predictable index for the occurrence of fillet-lifting is proposed as the fillet-lifting resistant index (FRI) that correlates well with the fillet-lifting occurrence rate. The fillet-lifting does not occur when a solder alloy has a FRI of 0.75 and above. The magnitude of the solidification temperature range (T) does not necessarily correlate with the fillet-lifting, because there are some alloys without fillet-lifting in spite of their having a wide T. There is also little correlation between the fillet-lifting and the formation of a Bi concentration at the solder/Cu land interface, previously thought to cause fillet-lifting. The Bi concentration at the solder/Cu land interface may occur as a consequence of the Sn consumption by the intermetallic compound formation with the Cu dissolving into the molten solder and existing at the interface rather than the solidification segregation.
Starting Page	1060
Ending Page	1067
Page Count	8
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	30
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2001-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free fillet-lifting alloy composition latent heat solidification temperature range cooling curve microstructure Sn-Ag-Bi ternary alloy Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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