NDLI: Investigation of Tin (Sn) Film Using an Aerosol Jet Additive Manufacturing Deposition Process

Content Provider	Springer Nature Link
Author	Fortier, Aleksandra Liu, Yue Ghamarian, Iman Collins, Peter C. Chason, Eric
Copyright Year	2017
Abstract	The quality of a Sn film deposited by the aerosol process is compared against the quality of Sn films deposited with traditional electroplating. Using the aerosol additive deposition technique, a Sn film was deposited on a brass substrate and exposed to room (25°C) temperature environments for 30 days, followed by a laser photosintering process. The film characteristics and content, formation of intermetallic compounds, residual stress distribution, grain texture, and the tendency of the film to grow Sn whiskers were analyzed. The preliminary results show a successful deposition of Sn film with an aerosol jet process and tensile residual stresses, whereas it was compressive in nature for electroplated Sn film. X-ray diffraction results also show the absence of intermetallic compound (IMC) formation in the aerosol jet-deposited film, while electroplated Sn film has a significant presence of IMC. The aerosol jet-deposited Sn film has the potential to resist nucleation of Sn whiskers under the operating conditions used in this study.
Starting Page	5174
Ending Page	5182
Page Count	9
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	46
Issue Number	8
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2017-04-26
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Sn film Sn whiskers additive manufacturing stress state grain texture Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers

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Investigation of Tin (Sn) Film Using an Aerosol Jet Additive Manufacturing Deposition Process

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