NDLI: Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

Content Provider	Springer Nature Link
Author	Kotadia, H. R. Mokhtari, O. Bottrill, M. Clode, M. P. Green, M. A. Mannan, S. H.
Copyright Year	2010
Abstract	In this study we consider the effect of separately adding 0.5 wt.% to 1.5 wt.% Zn or 0.5 wt.% to 2 wt.% Al to the eutectic Sn-3.5Ag lead-free solder alloy to limit intermetallic compound (IMC) growth between a limited volume of solder and the contact metallization. The resultant solder joint microstructure after reflow and high-temperature storage at 150°C for up to 1000 h was investigated. Experimental results confirmed that the addition of 1.0 wt.% to 1.5 wt.% Zn leads to the formation of Cu-Zn on the Cu substrate, followed by massive spalling of the Cu-Zn IMC from the Cu substrate. Growth of the Cu$_{6}$Sn$_{5}$ IMC layer is significantly suppressed. The addition of 0.5 wt.% Zn does not result in the formation of a Cu-Zn layer. On Ni substrates, the Zn segregates to the Ni$_{3}$Sn$_{4}$ IMC layer and suppresses its growth. The addition of Al to Sn-3.5Ag solder results in the formation of Al-Cu IMC particles in the solder matrix when reflowed on the Cu substrate, while on Ni substrates Al-Ni IMCs spall into the solder matrix. The formation of a continuous barrier layer in the presence of Al and Zn, as reported when using solder baths, is not observed because of the limited solder volumes used, which are more typical of reflow soldering.
Starting Page	2720
Ending Page	2731
Page Count	12
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	39
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2010-10-01
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Pb-free solder intermetallic interfacial reactions Sn-Ag solder alloy spalling Solid State Physics Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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