NDLI: Isotropic conductive adhesives with fusible filler particles

Content Provider	Springer Nature Link
Author	Kim, Jong Min Yasuda, Kiyokazu Fujimoto, Kozo
Copyright Year	2004
Abstract	A new low-temperature assembly process using a new class of isotropic conductive adhesives (ICAs) with fusible filler particles was proposed to realize a low-temperature, fluxless and cost-effective, alternative, solder flip-chip interconnection technology. New ICA formulations were developed using two different resin materials and fusible filler particles. The curing behavior of the resin materials and the melting of the fusible filler were observed by differential scanning calorimetry (DSC). The coalescence and wetting states, the size distribution of the fusible fillers, and the formation of the conduction path in each ICA formulation were observed with a laser microscope. It was found that two different types of electrical conductive paths, necking type and bump type, were produced. The bump-type conductive path was more effective than that of the necking type in achieving a lower electrical resistance through resistance measurement. The reduction capability of the base resin material was effective for the coalescence and the wetting of the fusible fillers and affected the conductive path type. A good metallurgical connection was formed between the fusible fillers in ICAs and between the fusible fillers and the copper surface even at the lower filler-volume fraction of 30%.
Starting Page	1331
Ending Page	1337
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	33
Issue Number	11
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2004-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Coalescence and wetting characteristics fusible filler low-temperature process Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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