NDLI: Thermomechanical Stress and Strain in Solder Joints During Electromigration

Content Provider	Springer Nature Link
Author	Zhang, J.S. Xi, H.J. Wu, Y.P. Wu, F.S.
Copyright Year	2009
Abstract	Thermomechanical stress and strain in the solder joints of a dummy area array package were studied as electromigration occurred. A current density of 0.4 × 10$^{4}$ A/cm$^{2}$ was applied to this package, constructed with 9 × 9 solder joints in a daisy chain, to perform the electromigration test. After 37 h, the first joint on the path of the electron flow broke off at the cathode, and the first three solder joints all exhibited a typical accumulation of intermetallic compounds at the anode. Different solder joints exhibited dissimilar electromigration states, such as steady state and nonsteady state. Finite element analysis indicated that during steady-state electromigration, although the symmetrical structure produced uniform distributions of current density and Joule heating in all solder joints, the distribution of temperature was nonuniform. This was due to the imbalanced heat dissipation, which in turn affected the distribution of thermomechanical stress and strain in the solder joints. The maximum thermomechanical stress and strain, as well the highest temperature and current crowding, appeared in the Ni/Cu layer of each joint. The strain in the Ni/Cu layer was significant along the z-axis, but was constrained in the x–y plane. The thermomechanical stress and strain increased with advancing electromigration; thus, a potential delamination between the Ni/Cu layer and the printed circuit board could occur.
Starting Page	678
Ending Page	684
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	38
Issue Number	5
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2009-02-05
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Solder joint electromigration steady state thermomechanical stress strain Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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