NDLI: The effect of thin film structure and properties on gold ball bonding

Content Provider	Springer Nature Link
Author	Krzawski, J. E. Razon, E. Hmiel, A. F.
Copyright Year	1998
Abstract	The gold ball bonding process is widely used for making interconnections between integrated circuit chips and package lead frames, yet the relationships between the wire/substrate materials properties and the bond formation processes are not yet well understood. While the creation of a metallurgical bond at the interface between the wire and substrate is required, the deformation of the wire and substrate also play an important role in bond formation. Bonding to thin film substrates is of particular interest, since thin films often exhibit mechanical behavior distinctly different from bulk materials. In the present study, a systematic investigation has been conducted to understand the effects of the structure and properties of aluminum thin films on the quality of gold ball bonds. A series of aluminum thin films was fabricated with systematic variations in hardness, roughness, thickness, and composition. Gold wires were ball bonded to these substrates, and the bondability and bond shear strengths were assessed. Metallographic sections of several of these specimens were made and examined in the scanning electron microscope. The results show that the film thickness has the most dominant effect on the bondability and bond strength; films that were 0.5 µm thick often exhibited low strength or poor bondability. Very hard films also gave poor results. Ultimately, these results can be used to predict the wire bond reliability expected from various types of thin film metallization.
Starting Page	1211
Ending Page	1215
Page Count	5
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	27
Issue Number	11
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	1998-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Aluminum metallization bondability gold ball bonding shear strength Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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