NDLI: Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures

Content Provider	Springer Nature Link
Author	Park, T. S. Dao, M. Suresh, S. Rosakis, A.J. Pantuso, D. Shankar, S.
Copyright Year	2008
Abstract	This paper presents the results of a systematic study of curvature and stress evolution during thermal loading in single- and multilevel interconnect line structures which have been deposited on a much thicker substrate. Effects of line aspect ratio, passivation geometry, and metal density within a metalization level on thermal stress evolution in the lines are addressed. The current analytical stress model enables us to predict that interaction between lines on the same level, i.e., in the lateral direction, is so strong that it cannot be neglected. A two-dimensional (2-D) finite element method has been used to verify the accuracy of the current model, while available experimental data have been compared with theory. In order to capture the exact variation of the thermal stresses at different metalization levels, and to investigate the effect of the upper level line arrangements on the stress states at the lower level, a three-dimensional (3-D) finite element analysis was employed. It can be seen that the interaction between levels in the vertical direction is quite weak when the thickness of the interlevel dielectric (ILD) layer becomes comparable to that of the metal layer.
Starting Page	777
Ending Page	791
Page Count	15
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	37
Issue Number	6
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2008-03-18
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Copper curvature multilevel metalization thermal stress thin-film structure Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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