NDLI: High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films

Content Provider	Springer Nature Link
Author	Chen, Gang Sun, Xiu Hu Nie, Peng Mei, Yun Hui Lu, Guo Quan Chen, Xu
Copyright Year	2012
Abstract	Creep behavior of nano-silver paste films has been studied over the tensile stress range from 2 MPa to 7.5 MPa and the temperature range from 100°C to 175°C. In this study, all creep tests were conducted on a micro uniaxial fatigue testing system (MUF-1020). It was observed that, under the above test conditions, the steady-state creep rate of the films, $$ \dot{\varepsilon } $$ , could be sufficiently described by a power-law creep equation in which both the tensile stress and the temperature were involved. Creep rupture life was analyzed by the following two methods: the Monkman–Grant relationship and the θ projection concept. Based on accurate measurement of the creep strain rate, the prediction of creep life by the Monkman–Grant relation is very close to the test results. The θ projection concept is not only an effective way to predict the creep life, but also an appropriate approach to determine a precise value of creep strain rate. In addition, the Kachanov damage evolution law was employed to investigate the damage evolution of the films. The study showed that the process of damage evolution of the nano-silver films was temperature independent for all tests performed.
Starting Page	782
Ending Page	790
Page Count	9
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	41
Issue Number	4
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2012-02-08
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Nano-silver paste low-temperature sintering creep life prediction damage evolution Solid State Physics Characterization and Evaluation of Materials Optical and Electronic Materials Electronics and Microelectronics, Instrumentation
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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