NDLI: Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate

Content Provider	Springer Nature Link
Author	Chuang, Cheng Li Aoh, Jong Ning Pan, Chi Chuan
Copyright Year	2012
Abstract	A nickel layer and a silver bonding layer have been deposited on copper electrodes over flex substrates to improve the bondability and die-shear force performance of chip–flex substrate assemblies when using the thermosonic flip-chip bonding process. For bonding temperature of 200°C, the maximum die-shear force was achieved by combining parameter values of 20.66 W ultrasonic power, 625 gf bonding force, and 0.5 s bonding time. The improved bondability and die-shear force could be attributed to better transfer of ultrasonic power across the bonding interface during thermosonic flip-chip bonding, owing to the high rigidity of the copper electrodes provided by the nickel layer. Experimental results also indicated that high bonding load is necessary at elevated ultrasonic power range to provide firm contact between the bumps and electrodes to enable smooth ultrasonic power transfer across the bonding interface. Moreover, prolonged bonding time caused cracks between the bumps and flex substrate. Close examination of the fracture morphologies after die-shear testing and after ultrasonic separation provided insight into the die-shear force performance as influenced by the process parameters and by the deposition of the nickel layer on the copper electrodes over the flex substrate.
Starting Page	2621
Ending Page	2630
Page Count	10
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	41
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2012-06-28
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Thermosonic flip-chip bonding copper electrode flex substrate nickel layer Solid State Physics Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Enhancements of bondability and die-shear force of chips thermosonically bonded to flex substrates by depositing a nickel layer

Increasing bondability and bonding strength of gold bmps thermosonic bonding to flex substrates by depositing a nickel layer

HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

Effect of bond force profile on bondability of thermosonic flip chip bonding

Reliability of HTS and HH/HT tests performed in chips and flex substrates assembled by a thermosonic flip-chip bonding process

Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition

Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding

Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate

Similar Documents

Enhancements of bondability and die-shear force of chips thermosonically bonded to flex substrates by depositing a nickel layer

Increasing bondability and bonding strength of gold bmps thermosonic bonding to flex substrates by depositing a nickel layer

HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

Effect of bond force profile on bondability of thermosonic flip chip bonding

Reliability of HTS and HH/HT tests performed in chips and flex substrates assembled by a thermosonic flip-chip bonding process

Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition

Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding

Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate