NDLI: Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Content Provider	Springer Nature Link
Author	Chen, Xi Hu, Anmin Li, Ming Mao, Dali
Copyright Year	2008
Abstract	Oxidation of four typical lead frame copper alloys was investigated. The oxidation rate and adhesion strength of oxide films to copper alloy substrates were studied by measuring the thickness and carrying out peel tests. The results show that, although copper alloys C5191 and C7025 have thinner oxide films, a lower adhesion strength and a higher proportion of CuO were obtained than in the other copper alloys EFTEC64T and C194. The adhesion strength is mainly influenced by the structure of the oxide film of the copper alloys, especially the CuO/Cu$_{2}$O ratio in the film. The highest adhesion strength is obtained for the copper oxide film with a basic structure of CuO/Cu$_{2}$O/Cu and a CuO/Cu$_{2}$O ratio of about 0.1. The segregation of additional elements in the copper alloy plays an important role in the oxide film structure.
Starting Page	372
Ending Page	378
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	38
Issue Number	2
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2008-11-06
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Oxidation adhesion strength lead frame copper alloy diffusion Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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