NDLI: Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process

Content Provider	Springer Nature Link
Author	Chung, Bo Mook Baek, Yong Ho Choi, Jaeho Huh, Joo Youl
Copyright Year	2012
Abstract	The microstructural evolution between Sn-3Ag-0.5Cu (SAC305) solder and Ni(P)/Pd(P)/Au finish during the reflow process was investigated for various Pd(P) thicknesses (0 μm to 0.6 μm). The reflow process was carried out in a belt-conveying reflow oven with peak temperature of 260°C. In the early stages of the reflow process, the Pd(P) layer either dissolved or spalled in the form of (Pd,Ni)Sn$_{4}$ into the molten solder, leaving behind an Ni$_{2}$SnP/Ni$_{3}$P bilayer on the Ni(P) layer. From the dissolution of the spalled (Pd,Ni)Sn$_{4}$ particles during the reflow process, the solubility of Pd in the molten SAC305 solder in the reflow process was estimated to be 0.18 wt.% to 0.25 wt.%. Regardless of the ratio of solder volume to pad opening size, the Ni$_{2}$SnP layer that formed in the early stage of reflow had a significant influence on the subsequent formation and growth of (Cu,Ni)$_{6}$Sn$_{5}$ at the solder interface. As the Ni$_{2}$SnP layer became thicker with increasing Pd(P) thickness, the formation of (Cu,Ni)$_{6}$Sn$_{5}$ became increasingly sluggish and occurred only at locations where the Ni$_{2}$SnP layer was locally thin or discontinuous, leading to a discontinuous morphology of (Cu,Ni)$_{6}$Sn$_{5}$. This was attributed to the Ni$_{2}$SnP layer that became an increasingly effective barrier to Ni diffusion with increasing thickness. Based on the experimental results, this study suggests detailed mechanisms underlying the effects of the Pd(P) thickness on the morphology and growth of the (Cu,Ni)$_{6}$Sn$_{5}$ formed during the reflow process.
Starting Page	3348
Ending Page	3358
Page Count	11
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	41
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2012-11-06
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Interfacial reaction ENEPIG surface finish Sn-Ag-Cu Ni$_{2}$SnP diffusion barrier Electronics and Microelectronics, Instrumentation Solid State Physics Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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