NDLI: Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

Content Provider	Springer Nature Link
Author	Sivasubramaniam, V. Bosco, N.S. Janczak Rusch, J. Cugni, J. Botsis, J.
Copyright Year	2008
Abstract	The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150°C) were studied. Composite solders were prepared by either incorporating 2 wt.% Cu (3 μm to 20 μm) or Cu$_{2}$O (∼150 nm) particles into SAC405 paste. Aggressive flux had the effect of reducing the Cu$_{2}$O nanoparticles into metallic Cu which subsequently reacted with the solder alloy to form the Cu$_{6}$Sn$_{5}$ intermetallic. While all solders had similar interfacial intermetallic growth upon reflow, both of the composite solders’ growth rates slowed through aging to reach a common growth rate exponent of approximately 0.38, considerably lower than that of the nonreinforced solder (n = 0.58). The nanoscale reinforced solder additionally exhibited the highest tensile strength in both the initial and aged conditions, behavior also attributed to its quick conversion to a stable microstructure.
Starting Page	1598
Ending Page	1604
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	37
Issue Number	10
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2008-07-29
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solder nanocomposite aging intermetallic compounds tension test Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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